Crystal oscillators require a unique quartz resonator for each frequency. The
crystal oscillator assembly process requires the quartz to be cut, x-rayed,
lapped, mounted, and sealed into the final package .
Fabrication of these resonators becomes increasingly difficult at frequencies
over 100 MHz because the resonator must be manufactured to very tight
tolerances.
The complexity of the manufacturing process is subject to poor yield at
multiple steps within the process forcing material restarts and overall
production delays.In addition to silicone bowl lead times, reliability is a chief concern with
quartz oscillators. Quartz oscillators are susceptible to contamination which
can affect both the center frequency and the ability of the XO to start up
reliably. If an oscillator fails in the end application, often the entire system
fails because the oscillator provides critical timing for the electronics.
The industry has long been searching for a technology that enables the
replacement of quartz oscillators with a solution that addresses lead time and
reliability concerns while providing Oem Silicone performance on par with quartz oscillators.
Over the last several years, micro-electromechanical system (MEMS)-based
oscillators have emerged as a possible replacement technology for quartz
oscillators. MEMS-based oscillators provide an alternative solution to quartz by
replacing the quartz oscillator with a CMOS-based mechanical resonator.
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